RVSI Reports $2.2 Million Order for Integrated Circuit Substrate Inspection Sys.

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\r\nRVSI Reports $2.2 Million Order for Integrated Circuit Substrate Inspection Systems\r\n
\r\nOrder from an Asian material supplier represents a new served market\r\n
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\r\nCANTON, Mass., Oct. 22 /PRNewswire-FirstCall/ — Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV – News) today said it has received a $2.2 million order for 3-D substrate inspection systems from a major Asian material supplier. The multi-system order is the first of its kind for RVSI and represents an important new market for the company.“;“Substrates are part of advanced integrated circuit packages such as microprocessors. Substrates typically contain microscopic solder \“bumps\“ which must be mated to bumps or bump locations on a semiconductor chip to which the substrate will be bonded. 3-D inspections on substrates include measurement of bump volume, height, area and position. Inspection also provides quality assurance of bumps after test, and aids in development of flip- chip packaging.\r\n
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\r\n\“We are told by our customers that they currently have no automated inspection capability for substrates, and hence no ability to check for bump coplanarity,\“ said Michael Gray, the Semiconductor Equipment Group’s Vice President of Sales. \“Without this ability, substrate suppliers continually are at risk for shipping unacceptable parts to their customers. This order is evidence that the need for 3-D metrology inspection on flip-chip bump substrates is gathering momentum. At the same time, RVSI’s patented MicroMap technology is being recognized as the standard for bump measurement.\“\r\n
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\r\nIncluding this new substrate inspection system, which is part of RVSI’s LS-series, RVSI now provides 3-D inspection of semiconductors at three crucial stages of the manufacturing process where metrology is of paramount concern. RVSI provides the industry’s premier system for the inspection of assembled semiconductor packages through its LS-series lead scanners. RVSI’s WS-series of inspection tools facilitates wafer-level inspection of flip chip and bumped wafers. This newest member of the LS-series extends RVSI’s 3-D expertise to substrate inspection. Employing RVSI’s MicroMap laser technology, the new product provides extraordinarily high levels of 3-D inspection, acquiring several thousand surface profiles per second without relying on any moving parts inside the laser sensor. The compact design of the LS-series is easily deployed at many semiconductor and electronics manufacturing process steps.\r\n
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\r\n\“This application is the final piece of MicroMap’s evolving leadership of 3-D inspection throughout the assembly of flip chip devices, particularly those in the microprocessor marketplace,\“ Mr. Gray said. \“This order provides substantive evidence that high-volume substrate manufacturing inspection is finally ready to happen.\“\r\n
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