RVSI Gets Order for WS-2500 Wafer Inspection System

„One of the world’s largest microprocessor manufacturers orders a second WS-series system for combined 2-D and 3-D wafer inspection
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\r\nCANTON, Mass., Sept. 30 /PRNewswire-FirstCall/ — Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV – News) today said it has received an order for a WS-2500 bumped wafer inspection system from one of the world’s largest microprocessor companies. The U.S.-based company plans to use the system for 2-D defect inspection and 3-D bump height metrology of microprocessor wafers at a European facility.“;“\“Wafer bumping for microprocessors is part of manufacturers‘ requirements for MPUs that run cooler, faster, and with higher I/O capacity,\“ said Michael Gray, the Semiconductor Equipment Group’s Vice President of Sales. \“This repeat order is further evidence that RVSI’s combination of proprietary 3-D inspection technology and superior defect detection gives us the right tool at the right time to become the standard for production-speed wafer bumping. Because wafer fabricators are now using lower-cost processes to create bumps, there is a requirement for 100% inspection of those bumps. Because reliable, repeatable bump height metrology is one of the critical inspection points, RVSI is the obvious choice.\r\n
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\r\n\“We have built nearly 2000 inspection systems that monitor the quality of approximately 80% of the world’s integrated circuit packages. RVSI has the unique technology and support structure needed to meet the challenging demands of 100% bumped wafer inspection for microprocessor production,\“ Mr. Gray said.\r\n
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\r\n\“We believe this customer chose RVSI as a single-tool solution for 3-D metrology and 2-D surface defect inspection because we displayed ‚best in class‘ performance,\“ said Frank Jacovino, General Manager of Wafer Systems Products for RVSI. \“Because our customers have multiple choices for camera- based defect inspection, we have been told by their bump operation technologists that they have been extremely critical in their analysis of camera-based systems‘ defect inspection capabilities. We are gratified that this customer has come to us for a repeat order as they expand production of their latest-generation microprocessor line. We believe it is a reflection of our pre- eminent place in this emerging market for 3-D and 2-D inspection.\“\r\n
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\r\nRather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic- sized solder or gold \“bumps\“ that are directly deposited on the wafer for electrical connections. RVSI’s WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system’s capabilities include inspection of pre-reflow and post-reflow solder bumps and multi- process gold bumps. Depending upon wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system.\r\n
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