ESI Launches 3D IC Package Inspection System

„PORTLAND, Ore.–(BUSINESS WIRE)–May 6, 2002–Electro Scientific Industries, Inc. (Nasdaq:ESIO – news) today introduces the Model 8810, a 3D integrated circuit (IC) package inspection system to the global packaging and semiconductor industry, at SEMICON Singapore 2002.\r\n
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\r\nThe Model 8810 performs high-speed, 3D inspection of ball grid arrays (BGAs) and chip scale packages (CSPs) handled in trays. The system utilizes a proprietary vision sensor, enabling it to inspect devices at high speeds with an exceptional level of accuracy. The modular design provides a separate station for mark inspection so that the 3D sensor is efficiently optimized for inspecting devices. An easy-to-use graphical interface enables quick setup for high volume production, and allows customized data reports for statistical process control.\r\n
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\r\nEquipped with an integrated chip handler system, the Model 8810 has three pickup heads to obtain maximum sorting speed. With a high level of handling automation, this system does not require mechanical adjustment during device changeover. This results in more up-time and higher efficiency. Available measurements include coplanarity, true ball height, warpage, position error, pitch, ball width and missing balls. Using an in-line, U-shaped transport mechanism has reduced the footprint of the machine. This allows input and output to be contained on the same side of the tool, offering maximum operator convenience.\r\n
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\r\n\“Industry-leading packaging companies are continually turning to BGAs and CSPs to provide smaller device footprints at the best possible value,\“ said Lonnie Ellingson, General Manager for ESI’s Vision and Inspection group. \“The Model 8810 addresses the growing market need for inspection of these devices and maintains ESI’s commitment to providing customers with the most advanced machinery for fast and accurate handling and inspection.\“\r\n
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\r\nWith powerful Windows(TM) based software, the Model 8810 enables custom device recipe generation, quick device training, and easy data logging. The SEMI- compliant interface displays set-up information, real-time collected data and lot status, and live video of inspection images in a user-configurable workspace.\r\n
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\r\nAbout ESI’s Vision Products Group\r\n
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\r\nThe ESI Vision Products Group manufactures integrated, vision-based inspection systems for final inspection of IC marks, leads, and pads for the back-end semiconductor market. Systems are notable for high throughput rates, quick and easy change-over among a wide range of device types, and the flexibility to accommodate a variety of device input and output modalities. Complete vision solutions for wafer identification, wire and die bonding and SMD alignment and placement are also available.\r\n
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